Die set for the formation of cavities for metal packages to...

Details Die set for the formation of cavities for metal packages to... Die set for the formation of cavities for metal packages to...

B - Operations, Transporting

21

D

113/66

B21D 37/10 (2006.01) B21D 22/06 (2006.01) H01L 21/00 (2006.01) H01L 21/48 (2006.01)

Patent

CA 2002764

-25- ABSTRACT OF THE INVENTION A die set (40) includes a punch (46) for stamping a cavity in a work piece (45) to produce a flat base surface and sidewalls which are perpendicular to the base surface. A forming bushing (52) applies a deformation stress (56) perpendicular to the stress (57) applied by the punch (46) to direct metal flow. In one embodiment, the impact surface (48) of the punch (46) contains piercing points to increase the depth of (62) penetration of the punch (46). (FIGURE 2)

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