Die-stamped circuit board assembly for photoflash devices...

Details Die-stamped circuit board assembly for photoflash devices... Die-stamped circuit board assembly for photoflash devices...

B - Operations, Transporting

23

B

315/10, 26/127,

B23B 31/18 (2006.01) G03B 15/04 (2006.01) H05K 3/04 (2006.01)

Patent

CA 1160756

- 17 - TITLE: DIE-STAMPED CIRCUIT BOARD ASSEMBLY FOR PHOTOFLASH DEVICES AND METHOD OF MAKING ABSTRACT A circuit board assembly and method of making wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without severing the switch material.

373063

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