Die-stamped circuit board assembly having relief means and...

Details Die-stamped circuit board assembly having relief means and... Die-stamped circuit board assembly having relief means and...

H - Electricity

01

H

315/10, 26/127,

H01H 11/00 (2006.01) G03B 15/04 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1153477

D-22,510 - 21 - TITLE: DIE-STAMPED CIRCUIT BOARD ASSEMBLY HAVING RELIEF MEANS AND METHOD OF MAKING ABSTRACT A photoflash device circuit board assembly including a dielectric substrate and at least one switching element and conductor die-stamped therein. To assure that the delicate switch is not severed by the die's cutting edge during die-stamping, a relief means (e.g., slot) is provided within the substrate so that a segment of the switch can be aligned therewith. As an alternative, it is taught to provide stepped portions within the die's cutting edge to align with preselected portions of the switch and thus prevent total severance thereof.

373080

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