Die stamping system

B - Operations – Transporting – 21 – D

Patent

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164/92

B21D 45/02 (2006.01) B21D 28/16 (2006.01) B21D 45/00 (2006.01) B26D 7/18 (2006.01)

Patent

CA 1327158

Abstract of the Disclosure A die stamping system includes opposed die members which clamp a metal workpiece to be shaped, cut or pierced after which the die members are moved away from one another and a part is subsequently ejected wherein the ejector is controlled for a selected delay time by a plurality of cylinder assemblies mounted in a manifold so that they are connected to a source of inert gas such as nitrogen under high pressure and to a source of hydraulic pressure. Each cylinder assembly includes a piston associated with and exposed to, the nitrogen in the manifold. The cylinder assemblies are connected to a single hydraulic valve which has associated therewith an accumulator and which is operated simultaneously to actuate the cylinders. The hydraulic lines to the cylinders are provided in the manifold.

608475

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