Dielectric block plating process and a plating apparatus for...

Details Dielectric block plating process and a plating apparatus for... Dielectric block plating process and a plating apparatus for...

C - Chemistry, Metallurgy

25

D

204/11

C25D 5/02 (2006.01) C25D 5/08 (2006.01) C25D 7/04 (2006.01) H01P 1/205 (2006.01) H01P 11/00 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1323595

27598-42 ABSTRACT OF THE DISCLOSURE A dielectric block plating process and an apparatus for carrying out the same. An electrolytic solution is circulated through a plating tank in a substantially uniform flow in practically all interior regions of the plating tank to form conductive layers over predetermined areas of a conductive base layer formed on the surface of a dielectric block having through holes extending from the top surface to the bottom surface thereof. The dielectric block is immersed and held in the electrolytic solution contained in the plating tank so that the respective center axes of the through holes of the dielectric block extend in parallel to the direction of flow of the electrolytic solution.

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