H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/498 (2006.01) H01L 23/15 (2006.01)
Patent
CA 2528505
A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
Matière composite diélectrique contenant une résine benzocyclobutène renforcée et au moins environ 50 % en poids d'une charge inorganique. La présente invention concerne également des boîtiers électroniques possédant au moins une couche conductrice et au moins une couche de matière diélectrique. La matière composite diélectrique peut avoir une constante diélectrique inférieure à environ 3,5 et une perte diélectrique inférieure à environ 0,004.
Clough Robert S.
Li Fuming B.
Mao Guoping
O'bryan Nelson B. Jr.
Qu Shichun
3m Innovative Properties Company
Smart & Biggar
LandOfFree
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