Dielectric composition having controlled thermal expansion

Details Dielectric composition having controlled thermal expansion Dielectric composition having controlled thermal expansion

C - Chemistry, Metallurgy

04

B

31/106, 117/109

C04B 41/87 (2006.01) C03C 3/064 (2006.01) C03C 3/066 (2006.01) C03C 3/093 (2006.01) C04B 35/00 (2006.01) C04B 41/50 (2006.01) H01B 3/08 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1337673

Dielectric ink, paste and tape compositions having controlled thermal expansion contain a mixture of glasses wherein at least one glass has a coefficient of thermal expansion (CTE) below the CTE of the substrate to which the dielectric composition is applied and at least one glass has a CTE above the CTE of said substrate. The dielectric compositions significantly reduce or eliminate warpage of the substrate.

610870

Affiliated with

Also associated with

Rating

Dielectric composition having controlled thermal expansion does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dielectric composition having controlled thermal expansion, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dielectric composition having controlled thermal expansion will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1321970