Dielectric curing of adhesives

Details Dielectric curing of adhesives Dielectric curing of adhesives

B - Operations, Transporting

29

C

B29C 65/04 (2006.01) C09J 5/06 (2006.01) C09J 5/10 (2006.01) B29C 65/48 (2006.01) B29C 65/50 (2006.01)

Patent

CA 2056838

- 37 - Abstract of the Invention A method and apparatus for bonding a non-conductive member to a conductive member by applying adhesive between mating surfaces of the non-conducting and conducting member and placing an electrode adjacent the non-conductive member overlying the mating surface. An RF generator applies an electric field between the non-conducting and conducting members to cure the adhesive by dielectric heating. 0614D

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