Dielectric embossing of foam

B - Operations – Transporting – 32 – B

Patent

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Details

154/71.01

B32B 3/30 (2006.01) B29C 59/02 (2006.01) B29C 65/04 (2006.01) B29C 59/00 (2006.01)

Patent

CA 1152878

ABSTRACT The process for dielectrically embossing flexible foam, particularly polyurethane foam assemblies, is improved by the present invention by thermally reticulating the foam prior to dielectrically embossing the foam. Inconsistencies in the dielec- tric embossing process are essentially eliminated by the thermal reticulation pretreatment of the foam.

350702

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