Dielectric encapsulating antenna

H - Electricity – 01 – Q

Patent

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Details

H01Q 23/00 (2006.01) H01Q 1/00 (2006.01) H01R 33/00 (2006.01)

Patent

CA 2604259

An apparatus and method for providing a broadband antenna is disclosed. For one embodiment of the invention, a molded antenna structure is provided having a gap between electrical components on the printed circuit assembly (PCA) and an overmolding of the antenna structure. One embodiment of the invention substantially reduces the degradation of the antenna performance in wideband modes of operation compared with prior art overmolding schemes. For one embodiment of the invention, the gap between the electrical components and the overmolding is formed by implementing a "cap" (covering) over the components on the PCA such that they are substantially surrounded by air between the cap and the PCA surface.

L'invention concerne un appareil et un procédé permettant d'engendrer une antenne à large bande. Dans un mode de réalisation de cette invention, une structure d'antenne moulée est pourvue d'un trou entre des composants électriques sur la carte imprimée équipée et d'un surmoulage de la structure d'antenne. Un mode de réalisation de ladite invention a trait à la diminution de la dégradation de l'efficacité d'antenne dans des modes de fonctionnement de large bande en comparaison à des schémas de surmoulage de la technique antérieure. Dans un mode de réalisation, le trou entre les composants électriques et le surmoulage est formé par installation d'un "couvercle" (recouvrement) au-dessus des composants de la carte imprimée équipée, de telle manière qu'ils sont sensiblement entourés par de l'air entre le couvercle et la surface de ladite carte.

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