H - Electricity – 01 – P
Patent
H - Electricity
01
P
H01P 3/18 (2006.01) H01P 11/00 (2006.01) H01Q 1/38 (2006.01) H01Q 15/00 (2006.01) H05K 1/02 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2469371
A substrate (300) for an RF device includes a plurality of layers (102) of dielectric material cofired in a stack. The plurality of layers (102) is formed from a material having a permittivity. Selected ones of the layers (102) have a pattern of perforations (100) formed in at least one perforated area (104). The perforated areas (104) are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region (504) of the substrate (300).
Chapell William Johnson
Smyth Thomas P.
Tebbe Dennis L.
Harris Corporation
Oldham Edward H.
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