Dielectric substrates comprising a polyimide core layer and...

H - Electricity – 01 – B

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H01B 3/30 (2006.01) B32B 7/12 (2006.01) B32B 27/28 (2006.01) B32B 27/34 (2006.01) H01B 3/44 (2006.01)

Patent

CA 2473824

An asymmetric multi-layer insulative film of improved internal adhesive strength is made by combining a layer of polyimide and a high- temperature bonding layer, the high-temperature banding layer being derived from a high temperature base polymer made of poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (PFA) and optionally blended with from 0-60 weight percent poly(tetrafluoroethylene- co-hexafluoropropylene) (FEP). The polyimide and high-temperature bonding layer laminate optionally also contains a layer of unsintered, partially sintered, or totally sintered polytetrafluoroethylene (PTFE) bonded directly to the high-temperature bonding layer. In addition, the polyimide high-temperature bonding layer laminate may be adhered to a poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) adhesive primer layer to more effectively bond the polyimide care layer to the high- temperature bonding layer. This type of primer layer may also be used as a polyimide-to-metal bonding layer to assist bonding of the polyimide to a metal wire or metal layer.

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