Dielectrically-engineered microparticles

B - Operations – Transporting – 03 – C

Patent

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Details

B03C 5/00 (2006.01) B22F 1/02 (2006.01) G01N 33/543 (2006.01)

Patent

CA 2409400

An engineered microparticle and methods and systems relating thereto. The microparticle includes a conductive core and an insulating layer surrounding the conductive core and having a thickness sufficient to render the microparticle responsive to a dielectrophoretic force.

L'invention concerne des microparticules conçues artificiellement et des procédés et systèmes correspondants. Les microparticules comportent un noyau conducteur et une couche isolante entourant le noyau conducteur et possédant une épaisseur suffisante pour faire réagir les microparticules à une force diéléctrophorétique.

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