Differential etching in acid fracturing

Details Differential etching in acid fracturing Differential etching in acid fracturing

C - Chemistry, Metallurgy

09

K

C09K 8/72 (2006.01)

Patent

CA 2577884

A method for fracturing a subterranean formation is provided in which inert masking material particles are injected into the formation with a dissolution agent so that the masking material inhibits dissolution where it contacts a portion of one or both fracture faces. The undissolved regions provide support to keep the fracture open after the treatment and the dissolved regions provide a conductive pathway for flow of fluid to or from the wellbore.

Cette invention concerne un procédé servant à la fracturation d'une formation souterraine, dans lequel les particules d'un matériau de masquage inerte sont injectées dans la formation avec un agent de dissolution, pour que le matériau de masquage empêche la dissolution là où il entre en contact avec une partie de l'une ou des deux faces de la fissure. Les zones non dissoutes forment un support qui maintient la fissure ouverte après le traitement et les zones dissoutes forment un trajet conducteur pour l'écoulement de fluide en direction et en provenance du trou de forage.

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