Differential thermal heating in microwave oven packages

Details Differential thermal heating in microwave oven packages Differential thermal heating in microwave oven packages

F - Mech Eng,Light,Heat,Weapons

24

C

217/14, 154/91.2

F24C 7/02 (2006.01)

Patent

CA 2003974

Packaging structures for the microwave cooking of foodstuffs are described which are formed from laminates which have an outer polymeric film layer, an outer support layer and a thin layer of electroconductive material between the outer layers of a thickness effective to produce thermal energy when exposed to microwave radiation. The laminate also incorporated one or more additional layers of material which result in differential degrees of heating being obtained from the thin layer of electroconductive material upon exposure of the packaging structure to microwave radiation. Specific examples of a pot pie dish and a pizza heating board are described.

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