Diode/capacitor assembly and method of constructing and...

Details Diode/capacitor assembly and method of constructing and... Diode/capacitor assembly and method of constructing and...

H - Electricity

01

L

356/10

H01L 25/00 (2006.01) H01G 4/40 (2006.01)

Patent

CA 1125436

DIODE/CAPACITOR ASSEMBLY AND METHOD OF CONSTRUCTING AND PROCESSING SAME Abstract of the Disclosure Wafers of silicon semiconductor material are stacked, bonded and severed to form a plurality of semiconductor diodes. One or more capacitor bodies are physically and electrically joined with these diodes, either by means of the capacitor bodies themselves or by means of an intermediate lead frame structure, in order to facilitate the handling and processing of the assembly as a unit.

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