Diode laser soldering system

B - Operations – Transporting – 23 – K

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327/1.3

B23K 26/06 (2006.01) B23K 1/005 (2006.01) B23K 26/00 (2006.01) H01R 43/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2000449

A laser soldering system wherein a plurality of laser beams are simultaneously directed to a plurality of spatially separate locations on a printed circuit board for simultaneously soldering. Each of the laser beams is formed by combining the outputs of a plurality of fiber cables, each of which is connected to an individual laser diode.

L'invention est un système de soudage laser dans lequel les faisceaux laser d'une pluralité de tels faisceaux sont dirigés simultanément sur une pluralité d'endroits séparés spatialement sur une carte de circuit imprimé pour y effectuer des opérations de soudage simultanées. Chacun des faisceaux laser est obtenu en combinant les faisceaux de sortie d'une pluralité de fibres optiques connectées chacune à une diode laser individuelle.

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