Diphase polymeric substrates for electroless metal deposition

Details Diphase polymeric substrates for electroless metal deposition Diphase polymeric substrates for electroless metal deposition

C - Chemistry, Metallurgy

09

D

117/183, 400/504

C09D 5/00 (2006.01) B05D 5/12 (2006.01) B32B 33/00 (2006.01) C08L 13/00 (2006.01) C08L 63/00 (2006.01) C23C 18/20 (2006.01) H05K 3/38 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1077643

Abstract of the Disclosure - New polymeric substrates for the electroless deposition of metal thereon. The substrates of the invention result from the polymerization of liquid mixtures comprising a liquid precursor of a polymer that is relatively susceptible to oxidative attack and a liquid precursor of a polymer that resists oxidation.

255541

Affiliated with

Also associated with

Rating

Diphase polymeric substrates for electroless metal deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diphase polymeric substrates for electroless metal deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diphase polymeric substrates for electroless metal deposition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-744426