Direct bonding of electroless metals to substrates

Details Direct bonding of electroless metals to substrates Direct bonding of electroless metals to substrates

H - Electricity

05

K

117/75, 204/18.6

H05K 3/38 (2006.01) C23C 18/20 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1007523

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