Direct imaging process for forming resist pattern on a...

H - Electricity – 05 – K

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H05K 3/00 (2006.01) B41M 5/24 (2006.01) B41M 5/36 (2006.01) H05K 3/02 (2006.01) H05K 3/06 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2091286

ABSTRACT OF THE DISCLOSURE A process is described for the direct production of an imaged pattern of resist on a substrate surface (such as a pattern of etch-resistant organic resin material on the surface of a copper-clad dielectric in connection with a printed circuit board (PCB) fabrication process), which process utilizes thermo-resists rather than photoresists, i.e., compositions which undergo thermally-induced, rather than photo-induced, chemical transformations. A film of thermo-resist composition applied to the substrate surface is scanned by a focused heat source (e.g., a thermal laser emitting in the IR region) in a predetermined pattern, without a phototool, to bring about localized thermally-induced chemical transformations of the composition which either directly produce the resist pattern or produce in the film a developable latent image of the pattern.

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