Direct imprinting of porous substrates

Details Direct imprinting of porous substrates Direct imprinting of porous substrates

B - Operations, Transporting

41

M

B41M 1/26 (2006.01) B41M 1/34 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2706053

Provided are methods of patterning porous materials on the micro- and nanometer scale using a direct imprinting technique. The present methods of direct imprinting of porous substrates ("DIPS"), can utilize reusable stamps that may be directly applied to an underlying porous material to selectively, mechanically deform and/or crush particular regions of the porous material, creating a desired structure. The process can be performed in a matter of seconds, at room temperature or higher temperatures, and eliminates the requirement for intermediate masking materials and etching chemistries.

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