Direct metallization

Details Direct metallization Direct metallization

C - Chemistry, Metallurgy

25

D

C25D 5/56 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2078422

ABSTRACT A direct metallization process is disclosed wherein plastic substrates may be electrolytically plated without the need for any prior electroless plating. The process uses a specially formulated post-activator composition at an elevated temperature to treat the activated substrate comprising either an alkaline solution containing an effective amount of metal ions which undergo a disproportionation reaction or an alkaline solution containing a metal ion such as Cu+2.

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