Directly injected forced convection cooling for electronics

Details Directly injected forced convection cooling for electronics Directly injected forced convection cooling for electronics

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 23/46 (2006.01)

Patent

CA 2700589

Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).

L'invention porte sur des circuits électroniques qui comprennent une carte de circuits imprimés (34) et au moins un composant (30, 32) monté sur la carte de circuits imprimés (34), le ou les composants (30, 32) générant de la chaleur en service, la carte de circuits imprimés (34) comprenant au moins une ouverture (48, 50) alignée avec le composant (30, 32) ou un composant respectif des composants, et les circuits électroniques étant conçus pour fournir, en service, un trajet permettant à un fluide de refroidissement de s'écouler à travers la ou chaque ouverture (48, 50) et au-delà du ou des composants (30, 32).

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