Dispersion for applying a metal layer

Details Dispersion for applying a metal layer Dispersion for applying a metal layer

C - Chemistry, Metallurgy

08

K

C08K 3/08 (2006.01) C08K 7/00 (2006.01) C09D 5/24 (2006.01) H01B 1/22 (2006.01)

Patent

CA 2727215

The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate, said dispersion containing an organic binder component, a metal component and a solvent component. The invention further relates to methods for producing said dispersion, to methods for producing an optionally structured metal layer using said dispersion and to the substrate surfaces obtained in said manner and the use thereof.

L'invention concerne une dispersion servant à appliquer une couche métallique sur un substrat non électroconducteur contenant un composant liant organique, un composant métallique ainsi qu'un composant solvant. L'invention concerne des procédés de production de la dispersion, des procédés de production d'une couche métallique éventuellement structurée à l'aide de la dispersion ainsi que les surfaces des substrats ainsi obtenues et leur utilisation.

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