Dispersion strengthened copper-base alloy for overlay

Details Dispersion strengthened copper-base alloy for overlay Dispersion strengthened copper-base alloy for overlay

C - Chemistry, Metallurgy

22

C

75/17

C22C 1/10 (2006.01) B23K 35/30 (2006.01) C22C 9/00 (2006.01) C22C 9/06 (2006.01) C22C 9/10 (2006.01) C22C 30/02 (2006.01)

Patent

CA 2022271

A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %, Ni: 5 to 30%; B: 0.5 to 3%; Si: 1 to 5%; Fe: 4 to 30%; Sn: 3 to 15% and/or Zn: 3 to 30%; and the remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti may be further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base .alpha. phase dendrites and serve as a solid lubricant.

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