Dissolution of metals

Details Dissolution of metals Dissolution of metals

C - Chemistry, Metallurgy

23

F

149/21

C23F 1/14 (2006.01) C23F 1/16 (2006.01)

Patent

CA 1194388

DISSOLUTION OF METALS ABSTRACT Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and certain primary diols. The present invention relates to the dissolution of metals in an aqueous bath containing sulfuric acid and hydrogen peroxide, and in particular to a novel bath composition capable of effecting the dissolution at high rates. In one specific aspect the invention is concerned with etching of copper in the production of printed circuit boards. BACKGROUND OF THE INVENTION As is well known in the art, in the manufacture of printed electronic circuits a laminate of copper and etch resistant material, usually plastic, is used. A common method of obtaining the circuits is to mask the desired pattern on the copper surface of the laminate with a protective resist material, which is imper- vious to the action of an etch solution. In a subsequent etching step, the unprotected areas of the copper are etched away, while the masked areas remain intact and provide the desired circuiting supported by the plastic. The resist material can be a plastic material, an ink or a solder. In the last few years, the industry has more and more turned to hydrogen peroxide-sulfuric acid systems for etching the electronic circuit boards, due to the low cost of the etching solutions and to the relative ease with which copper values can be recovered from the spent etch solutions. - 1 -

448145

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