Divinylarene dioxide formulations for vacuum resin infusion...

Details Divinylarene dioxide formulations for vacuum resin infusion... Divinylarene dioxide formulations for vacuum resin infusion...

C - Chemistry, Metallurgy

08

G

C08G 59/24 (2006.01) B29C 70/44 (2006.01) C08G 59/50 (2006.01) F03D 1/06 (2006.01)

Patent

CA 2744063

A resin formulation for use in a vacuum resin infusion molding process, said formulation comprising (a) a divinylarene dioxide, and (b) a polyaminoether; wherein the polyaminoether does not have pendent hydroxyl groups; and wherein the resin formulation may have a low viscosity of less than about 400 mPa-s.

La présente invention concerne une formulation de résine à utiliser dans un procédé de moulage par infusion de résine sous vide, ladite formulation comprenant (a) un dioxyde de divinylarène et (b) un polyaminoéther, lequel ne comporte pas de groupes hydroxyle latéraux. Ladite formulation de résine peut présenter une viscosité inférieure à environ 400 mPa-s.

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