Double cavity semiconductor chip carrier

Details Double cavity semiconductor chip carrier Double cavity semiconductor chip carrier

H - Electricity

01

L

356/5

H01L 25/00 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H05K 7/10 (2006.01)

Patent

CA 1142260

Gogal-1 DOUBLE CAVITY SEMICONDUCTOR CHIP CARRIER Abstract of the Disclosure A semiconductor device including a double cavity semiconductor chip carrier 100 which comprises a multi layer ceramic sandwich structure having a pair of semiconductor chip receiving cavities in the opposite faces thereof. The package enables mounting and electrical interconnection of a pair of semiconductor integrated circuit chips in a package of the same size as that for a single chip and having somewhat greater thickness. External terminals 93 on an outside face of the carrier are connected selectively by metallization paths 44, 53, 55, 83 integral with the carrier to chip mounting pads 41, 51 and to internal terminals 28 within the carrier. The internal terminals are disposed peripherally with respect to the chip cavities and adapted for interconnection with chip contact pads 26. Thus, a pair of unlike semiconductor integrated circuits can be interconnected in accordance with different patterns within a single package.

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