Double-dip pd/sn crosslinker

Details Double-dip pd/sn crosslinker Double-dip pd/sn crosslinker

C - Chemistry, Metallurgy

25

D

C25D 5/54 (2006.01) B05D 3/04 (2006.01) B05D 3/10 (2006.01) C23C 18/16 (2006.01) C23C 18/24 (2006.01) C23C 18/28 (2006.01) C23C 18/30 (2006.01) C25D 5/34 (2006.01) C25D 5/56 (2006.01) C25D 7/00 (2006.01)

Patent

CA 2355260

Process for the direct metallizing of the surface of a plastic object. The surface of the plastic object is roughened by pickling. The surface is activated with the aid of a colloidal or ionogenic aqueous solution of a first precious metal, which colloidal or ionogenic aqueous solution also contains a second base metal. This forms an activation coat on the surface containing the first precious and the second base metal. Electron conductivity of the activation coat is provided with the aid of a treatment solution, with which the second base metal is at least partially dissolved out of the activation coat and an electron conducting substance is adsorbed in the activation coat. Then the electron-conductive activation coat is metallized. Before the electron conducting activation coat is metallized, the sequence of steps "activation of the surface and establishment of electronic conductivity" is repeated at least once.

L'invention concerne un procédé de métallisation directe de la surface d'un objet en plastique, laquelle est rendue rugueuse par décrochage. La surface est activée au moyen d'une solution aqueuse colloïdale ou ionogène d'un premier métal précieux, laquelle contient aussi un second métal de base. On obtient un revêtement d'activation sur la surface, qui contient les deux métaux considérés. La conductivité électronique du revêtement d'activation est assurée par le biais d'une solution de traitement, qui permet de dissoudre au moins partiellement le métal de base hors du revêtement en question, et une substance à conductivité électronique est adsorbée dans le revêtement considéré. Ensuite, le revêtement d'activation à conductivité électronique est métallisé. Auparavant, on répète au moins une fois la séquence des étapes "activation de la surface et établissement de la conductivité électronique".

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