Double faced printed circuit board interconnection

Details Double faced printed circuit board interconnection Double faced printed circuit board interconnection

H - Electricity

05

K

356/18

H05K 1/11 (2006.01)

Patent

CA 1052475

DOUBLE-FACED PRINTED CIRCUIT BOARD INTERCONNECTION ABSTRACT OF THE DISCLOSURE A double-faced printed circuit board com- prises an insulative base board, a first conductive circuit interconnection pattern formed on one face of the base board, a second conductive circuit inter- connection pattern formed on the other face of the base board, a first through-hole extending from the first circuit interconnection pattern through the base board and formed at such a position that the first through-hole is not aligned with the second circuit interconnection pattern, a second through- hole extending from the second circuit intercon- nection pattern through the base board and formed at such a position that the second through-hole is not aligned with the first circuit interconnection pattern, and a conductive connecting member inserted into the first and second through-holes while bridging them. The first circuit interconnection pat-tern is soldered to the connecting member while the second circuit interconnection pattern is also soldered to the connecting member to establish electrical connec- tion between the first and second patterns.

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