B - Operations – Transporting – 24 – B
Patent
B - Operations, Transporting
24
B
51/123
B24B 1/00 (2006.01) B24B 53/00 (2006.01)
Patent
CA 1129207
RD-11,745 ABSTRACT OF THE DISCLOSURE A method comprising contacting a wetting liquid with the surface of a resin-bonded diamond grinding wheel, wetting and forming a film on the face of the resin component of the wheel surface, and grinding the resulting wetted wheel surface with a silicon carbide or silicon nitride ceramic body generating ceramic chips which adhere to said wetted resin face forming a slurry layer thereon which simultaneously dresses and conditions said wheel during grinding.
352168
Komanduri Rangachary
Reed William R. Jr.
Company General Electric
Eckersley Raymond A.
LandOfFree
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