Dry film photoresist including an intermediate uv...

G - Physics – 03 – C

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96/207

G03C 1/78 (1980.01)

Patent

CA 1143207

Abstract A dry film photoresist consisting of a two-layer base incorporating a solid polymeric substrate with a thickness of from 15 to 100 µ and an intermediate polymeric layer with a thickness of from 3 to 15 µ transparent to UV-radia- tion within the range of from 300 to 400 nm, a light-sensitive layer with a thickness of from 4 to 20 µ and a protective polymeric film with a thickness of from 5 to 50 µ. All the four of these layers are bonded therebetween by adhesion forces so that the adhesion of the protective polymeric film to the light-sensitive layer is less than the cohesion strength of the light-sensitive layer; the adhesion of the solid polymeric substrate to the intermediate polymeric layer is less than the adhesion of the intermediate polymeric layer to the light-sensitive layer and the adhesion force of each of the three above-mentioned layers is less than the cohesion strength of each of said layers. The dry film photoresist according to the present inven- tion possesses a high resolving power (minimal reproducible line of from 5 to 50 µ) and it is warping-resistant in both manufacture and use.

353707

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