Dry replenishment of electroless copper solutions

Details Dry replenishment of electroless copper solutions Dry replenishment of electroless copper solutions

C - Chemistry, Metallurgy

23

C

6/4

C23C 18/16 (2006.01)

Patent

CA 1069254

DRY REPLENISHMENT OF ELECTROLESS PLATING SOLUTIONS Abstract of the Disclosure This invention is for replenishment of an aqueous electroless plating solution using replenishers essentially free of diluents without decomposing the plating solution. Typical replenisher formulations comprise a combination of a source of metal ions such as cupric sulphate for copper plating solutions and a stabilizer, the stabilizer being in a concentration sufficient to over-stabilize the solution in the immediate vicinity of the plating solution where the replenisher is added, but insufficient, in combination with residual solution stabilizers, to poison the plating solution when thoroughly admixed therewith. Other addi- tives in the replenisher formulation may include complexing agent- brighteners, surfactants and the like. Essentially diluent free replenisher formulations are preferred for replenishment rather than aqueous solutions, as in the prior art, to prevent volume growth.

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