F - Mech Eng,Light,Heat,Weapons – 26 – B
Patent
F - Mech Eng,Light,Heat,Weapons
26
B
F26B 7/00 (2006.01) A61K 9/70 (2006.01) B01D 5/00 (2006.01) F26B 3/20 (2006.01) F26B 13/10 (2006.01) F26B 25/00 (2006.01)
Patent
CA 2422267
Method of selectively removing volatile components from a composition, comprising coating the composition onto a first substrate surface of a substrate (38), wherein the composition comprises a nonresident volatile component and a resident volatile component. The method further includes positioning at least a portion of the coated substrate (36) between a condensing surface (32) having a condensing surface temperature (Tc) and a heating surface (34) having a heating surface temperature (TH) that is greater than the condensing surface temperature, wherein the condensing surface (32) is in a spaced apart, confronting relationship to the coated surface (44) of the substrate (38) and wherein the heated surface (34) is in thermal contact with a second substrate surface (42) opposite the first substrate surface. In the method, the heated surface temperature (TH) and the condensing surface temperature (Tc) are such that the positioning step causes the nonresident volatile component to be selectively removed from the portion of the coated substrate. The method is suitable for forming transdermal drug delivery compositions (36).
L'invention concerne un procédé d'élimination sélective de constituants volatils dans une composition, consistant à revêtir la composition sur une première surface de substrat d'un substrat (38), cette composition comprenant un constituant volatil non résident et un constituant volatil résident. Ce procédé consiste, en outre, à positionner au moins une partie du substrat revêtu (36) entre une surface de condensation (32) possédant une température de surface de condensation (Tc) et une surface de chauffe (34) possédant une température de surface (TH) supérieure à la température de la surface de condensation, cette dernière (32) étant placée de façon espacée et en confrontation par rapport à la surface revêtue (44) du substrat (38), la surface chauffée (34) étant en contact thermique avec une seconde surface de substrat (42) située en face de la première surface de substrat. Dans ce procédé, la température de la surface chauffée (TH) et la température de la surface de condensation (Tc) sont telles que l'opération de positionnement entraîne l'élimination sélective du constituant volatil non résident de la partie du substrat revêtu (36).
Benson Peter T.
Cooklock Kathleen M.
Huelsman Gary L.
Jain Nirmal
Kolb William Blake
3m Innovative Properties Company
Smart & Biggar
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