Dual curing composition and use thereof

Details Dual curing composition and use thereof Dual curing composition and use thereof

C - Chemistry, Metallurgy

08

G

C08G 18/34 (2006.01) B05D 3/06 (2006.01) C08F 299/06 (2006.01) C08L 75/14 (2006.01) C09D 175/14 (2006.01) C09D 175/16 (2006.01) G03F 7/027 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H05K 1/03 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2073155

Abstract of the Disclosure A dual curing composition is prepared from components consisting essentially of (a) an isocyanate adduct having (i) free isocyanate groups and (ii) free photopolymerizable ethylenically unsaturated groups, wherein the ethylenically unsaturated groups comprise in the range of 10 to 70 % of the total of any free functional groups on said adduct; (b) reactive (meth)acrylate diluents; and (c) optionally, photoinitiator. When cured, the above composition is particularly suitable as a conformal coating on electronic circuit boards.

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