Dual cylindrical target magnetron with multiple anodes

Details Dual cylindrical target magnetron with multiple anodes Dual cylindrical target magnetron with multiple anodes

H - Electricity

01

J

H01J 23/027 (2006.01) C23C 14/35 (2006.01) H01J 37/317 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2156350

Two adjacent rotating cylindrical targets are used in a specific form of a vacuum sputtering system to deposit a film of material onto a substrate. Elongated anodes are provided on opposite sides and in between the targets in a manner to make more uniform the rate of deposition across the substrate.

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