Dual-enclosure optoelectronic packages

Details Dual-enclosure optoelectronic packages Dual-enclosure optoelectronic packages

G - Physics

02

B

G02B 6/36 (2006.01) G02B 6/42 (2006.01) G02B 7/00 (2006.01) H01S 3/04 (2006.01) H01S 5/022 (2006.01) H01S 5/024 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2383706

The invention is a package (100) housing optical components and electronic components in separate enclosures. The first enclosure (142/130/170/175) includes optical components (165/157/180), optical alignment means (160), and a heat pipe (155) that dissipates heat generated by the optical components therein. The first and second enclosures are hermetically sealed. The second enclosure (130/112/110/114) includes electronic components (120), a Peltier- type cooling device (125), and/or other heat dissipating devices. The first and second enclosures are each hermetically sealed. The first enclosure can be mounted above the second enclosure or vice versa in alternative embodiments of the invention. In another embodiment, a heat sink (105) is also mounted to the top of the dual-enclosure package.

L'invention concerne un boîtier (100) renfermant des composants optiques et des composants électroniques dans des gaines séparées. La première gaine (142/130/170/175) comprend des composants optiques (165/157/180), un dispositif d'alignement optique (160) et un caloduc (155) qui dissipe la chaleur générée par les composants optiques. Les première et seconde gaines sont hermétiquement fermées. La seconde gaine (130/112/110/114) contient des composants électroniques (120), un dispositif de refroidissement de type Peltier (125), et/ou des dispositifs de dissipation de la chaleur. Lesdites première et seconde gaines sont fermées hermétiquement. La première gaine peut être fixée au-dessus de la seconde gaine ou vice versa dans d'autres modes de réalisation de l'invention. Dans un autre mode de réalisation, un dissipateur thermique (105) est également fixé au niveau supérieur du boîtier à gaine duale.

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