Dual-in-line package assembly

Details Dual-in-line package assembly Dual-in-line package assembly

H - Electricity

05

K

339/7.1

H05K 1/14 (2006.01) H05K 7/10 (2006.01)

Patent

CA 1182539

Abstract of the Disclosure A dual-in-line package assembly for interconnection with a printed circuit board includes a base having a plurality of free-standing contacts and a DIP carrier having channels extending therethrough for jointly receiving DIP leads and base contacts and for biasing resililent portions of the base contacts upon the DIP leads interiorly of the carrier. The channels of carriers stacked in the assembly have common base contacts passing therethrough in registry with a lead of each stacked package.

406288

Affiliated with

Also associated with

Rating

Dual-in-line package assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dual-in-line package assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual-in-line package assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1303098