Dual-mode micrometer/millimeter wave integrated circuit package

H - Electricity – 01 – L

Patent

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Details

H01L 23/02 (2006.01) H01L 21/60 (2006.01) H01L 23/12 (2006.01) H01L 23/31 (2006.01) H01L 23/66 (2006.01)

Patent

CA 2231635

A dual-mode microwave/millimeter wave integrated circuit package with low cost, high operating frequency, quick cooling, and high reliability is disclosed. More particularly, the package structure of the invention supports both microstrip and coplanar waveguide operation modes, which cannot be accomplished by any prior microwave integrated circuit package structures.

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