H - Electricity – 05 – K
Patent
H - Electricity
05
K
347/36
H05K 7/20 (2006.01)
Patent
CA 1124381
ABSTRACT An air cooling arrangement for a column of integrated circuit modules is provided in which a pair of air moving devices are included, one located at the top and one at the bottom of the column each pulling air through the column. A heat sink having opposite side air outlets is attached to each of the modules and extends from the top side thereof. A cover plate having openings therein indexed with each of the heat sinks allows air to pass through the openings into the heat sinks. An air flow guide is located at each air outlet side of each heat sink and extends from the cover plate vertically into each heat sink to approximately the half way point to provide a vertical impinging air flow pattern which yields a high heat transfer coefficient. Air distri- bution ducts are arranged on opposite sides of the heat sinks parallel to the column and connected to the opposite side of air outlets of the heat sinks via air passages thereby providing a dividing of the flow across each heat sink. PO9-79-013
349771
Hwang Un-Pah
Simons Robert E.
International Business Machines Corporation
Na
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