G - Physics – 02 – B
Patent
G - Physics
02
B
G02B 6/12 (2006.01) G02F 1/035 (2006.01)
Patent
CA 2279068
An Integrated Optics Chip with improved performance when exposed to rapidly changing temperature is disclosed. The optic chip or integrated optic chip or MIOC has a top surface, a +Z face and -Z face. The chip is formed from a crystal having a high electro-optic coefficient such as Lithium Niobate. For the purpose of orienting the components to the optic chip to be described, the +Z crystal axis extends outward from the +Z face. An input waveguide formed in the top surface of the chip and orthogonal to the +Z axis receives an optical signal from an input port, passes the signal via a waveguide network, to an output waveguide coupling the waveguide network to an output port. Metalization is applied to the top face of the optic chip to form at least a first and a second rail. The first and second rails are positioned to very closely straddle a portion of the input waveguide. A conductive bridge connects the first and second rails to prevent a charge differential from developing between the first and second rails.
Gampp Lorrie L.
Geosling Christine E.
Rahn John P.
Zimmerman Gregory A.
Litton Systems Inc.
Macrae & Co.
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