Dual solder process for connecting electrically conducting...

Details Dual solder process for connecting electrically conducting... Dual solder process for connecting electrically conducting...

H - Electricity

05

K

26/141, 339/11.6

H05K 3/34 (2006.01) B23K 1/20 (2006.01) B23K 35/26 (2006.01) H01R 43/20 (2006.01) H01R 43/02 (2006.01)

Patent

CA 1284190

ABSTRACT OF THE INVENTION A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by utilizing a high temperature solder material formed in mounds on defined areas of the conductors, coating the mounds with low temperature solder paste and mating the terminals of the component to the mounds by forcing them through the low temperature solder coatings prior to reflowing and cooling the low temperature solder.

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