H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 13/04 (2006.01)
Patent
CA 2544758
A system for electronic component 20 processing, including: a frame 11 configured to hold a printed circuit board 25; a tool head 12 connected to the frame 11, the tool head 12 being configured to position an electronic component 20 on top of the printed circuit board 25; a heater 14 disposed in the tool head 12, the heater 14 being configured to direct heat towards the electronic component 20; and a dual-stage pre-heater 30 connected to the frame 11, the dual-stage pre-heater 30 being configured to direct heat towards the printed circuit board 25, wherein the pre-heater 30 comprises: a first stage 32 configured to direct heat over a wide area of the printed circuit board 25; and a second stage 34 configured to heat a focused region of the printed circuit board 25 adjacent to the electronic component 20.
L'invention porte sur un système de traitement de composants électroniques (20) comportant: un cadre (11) servant de support à une plaquette (25) de circuit imprimé; une tête d'outil (12) reliée au cadre (11) et servant à positionner un composant électronique (20) sur la plaquette (25); un réchauffeur (14) placé dans la tête d'outil (12), et dirigeant sa chaleur sur le composant électronique (20); et un préréchauffeur (30) à deux étages relié au cadre (11) et dirigeant sa chaleur sur la plaquette (25); le préréchauffeur (30) comprend lui-même: un premier étage (32) dirigeant sa chaleur sur une large surface de la plaquette (25), et un deuxième étage focalisant sa chaleur sur une zone de la plaquette (25) jouxtant le composant électronique (20).
Carlomagno Mike
Ho Albert
Mishin Artem
Deeth Williams Wall Llp
Delaware Capital Formation Inc.
LandOfFree
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