Dynamic die penetration monitor

Details Dynamic die penetration monitor Dynamic die penetration monitor

B - Operations, Transporting

30

B

B30B 15/14 (2006.01)

Patent

CA 2323755

An apparatus and method for monitoring die penetration depth of a mechanical press which does not directly measure die penetration depth is disclosed. Actual slide displacement curves under load conditions are continually generated for the press being monitored. The point at which the slide contacts the stock material, the dynamic die bottom dead center point of the slide, and the material thickness are utilized to compute actual die penetration depth. Additionally, theoretical die penetration depth may be calculated using values of theoretical contact point, theoretical bottom dead center and material hardness. Computed values of actual and theoretical die penetration depth as well as corresponding press operational parameters are stored in a database and provide a means of predicting die penetration depth for a particular operational condition of a mechanical press.

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