Easily peelable semiconductive resin composition

Details Easily peelable semiconductive resin composition Easily peelable semiconductive resin composition

H - Electricity

01

B

31/158, 400/3076

H01B 1/24 (2006.01) C08K 3/04 (2006.01) C08L 23/08 (2006.01) H01B 9/02 (2006.01)

Patent

CA 1317050

ABSTRACT OF THE DISCLOSURE An easily peelable semiconductive resin composi- tion comprising 100 parts by weight of ethylene-vinyl acetate copolymer-based polymer component, 1 to 20 parts by weight of waxy aliphatic hydrocarbon, and 50 parts by weight or more of furnace carbon black having an arithmetic mean particle size of 25 to 40 mµ, iodine adsorption of 40 to 60 mg/g, and DBP oil absorption (by JIS A method) of 120 to 150 ml/100 g.

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