Eb-curable acrylic hot melt pressure-sensitive adhesives

Details Eb-curable acrylic hot melt pressure-sensitive adhesives Eb-curable acrylic hot melt pressure-sensitive adhesives

C - Chemistry, Metallurgy

09

J

204/91.62

C09J 4/02 (2006.01) C08F 222/14 (2006.01) C08F 246/00 (2006.01) C09J 7/02 (2006.01)

Patent

CA 1337187

There is provided a radiation-curable, pressure- sensitive-adhesive layer formed of at least one monomer having a glass-transition temperature greater than about -25°C and an entanglement molecular weight less than about 20,000; at least one monomer having a glass- transition temperature less than about -25°C and an entanglement molecular weight greater than about 20,000: and at least one tackifier monomer having a glass- transition temperature greater than -25°C and an entanglement molecular weight of at least about 20,000 and present in an interpolymerized amount sufficient to form an interpolymer having a glass-transition temperature less than about -25°C and an entanglement molecular weight greater than about 20,000. Cure is preferably by electron beam, and a multifunctional monomer is preferably provided to improve shear.

548769

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