Edge clip terminal for mounting thick film hybrid circuits...

H - Electricity – 05 – K

Patent

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356/11

H05K 1/02 (2006.01)

Patent

CA 1139011

D-24,330C EDGE CLIP TERMINAL FOR MOUNTING THICK FILM HYBRID CIRCUITS IN PRINTED CIRCUIT BOARDS By Paul R. Ellis, Jr. ABSTRACT OF DISCLOSURE An improved edge clip terminal having a diamond-shaped transition region connecting a plurality of tines, that clip over the edge of a substrate, to a first lead section and having a second diamond-shaped transition region connecting the first lead section to a second lead sec- tion. In an assembly, the second lead sections of a plurality of term- inals are located in holes in a PC board with the second transition regions resting on the surface of the circuit board. The first lead sec- tions are more narrow than the transition regions and of lengths that are sufficient for preventing solder wicking up them and into the areas of the tines during wave soldering of a circuit board so that a leaded substrate soldered into the circuit board may be tilted without damaging it.

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