Edge contouring of semiconductor wafers

Details Edge contouring of semiconductor wafers Edge contouring of semiconductor wafers

H - Electricity

01

L

356/151, 356/185

H01L 21/306 (2006.01) H01L 21/00 (2006.01) H01L 29/06 (2006.01)

Patent

CA 1038969

Abstract In a disc-like semiconductor pellet or wafer hav- ing a PN junction therewithin generally parallel to the major surfaces of the wafer, a groove is formed in one major surface to define a mesa having a PN junction terminating at the mesa side surface. The mesa side surface and a portion of the top surface thereof are then etched to pro- vide the mesa with a side surface which is generally convex where it is intersected by the PN junction and which is generally concave where it joins the mesa top surface. -1-

232120

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