Ehf array antenna backplate

Details Ehf array antenna backplate Ehf array antenna backplate

H - Electricity

01

Q

H01Q 21/00 (2006.01) H01Q 23/00 (2006.01)

Patent

CA 2045856

EHF ARRAY ANTENNA BACKPLATE ABSTRACT An EHF array antenna backplate that integrates thermal cooling structure and signal processing structure together into one unified structure. In one embodiment, forced air is employed to conduct heat from active modules; while in another embodi- ment, embedded heat pipes are employed. The array backplate is made by using four layers. The layers are: a high density multichip interconnect board, a metal matrix com- posite motherboard, an integrated waveguide/cavity/cooling structure, and a metal ma- trix composite baseplate. Each module uses solder bumps to connect to the high densi- ty multichip interconnect board where DC power and control logic signal distribution takes place. The modules are soldered in four locations to the metal matrix composite motherboard through openings in the high density multichip interconnect board. EHF signals are coupled to the modules from a resonant cavity via probes that protrude through the high density multichip interconnect board. Probes are strategically located in the resonant cavity to pick up an EHF standing wave generated by slots that are part of a slotted planar waveguide EHF 16-way power divider network. The waveguide/ cavity/cooling structure is also the primary load-bearing member of the backplate.

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