B - Operations – Transporting – 23 – B
Patent
B - Operations, Transporting
23
B
356/143
B23B 31/20 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01)
Patent
CA 1261976
ABSTRACT OF THE DISCLOSURE ELASTIC BLADDER METHOD OF FABRICATING AN INTEGRATED CIRCUIT PACKAGE HAVING BONDING PADS IN A STEPPED CAVITY An integrated circuit package is fabricated by assembling a stack which is comprised of a plurality of thin flat epoxy-glass layers, adhesive layers between the epoxy-glass layers, and a staircase-shaped cavity. This cavity extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along a portion of the flat surface. of the internal epoxy-glass layer, and then penetrates through it. Conductors lie on the internal epoxy-glass layer including bonding pads on the flat sur- face portion. After the stack is assembled, the outer epoxy-glass layer and the cavity are covered with an elastic bladder. Subsequently, the stack is laminated by forcing a fluid into the bladder at a temperature and pressure which causes the bladder's membrane to stretch and push against all the surfaces of the cavity. This dams the adhesive from flowing onto the bonding pads.
527563
R. William Wray & Associates
Unisys Corporation
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